China (Mainland)
Micro-Dicyandiamide CAS NO.461-58-5
- Min.Order: 1 Kilogram
- Payment Terms: L/C,T/T,Other
- Product Details
Keywords
- Dicyandiamide
- DCD
- DCDA
Quick Details
- ProName: Micro-Dicyandiamide
- CasNo: 461-58-5
- Molecular Formula: C2H4N4
- Appearance: Free flowing white powder.
- Application: Usage: 1. Micro-dicyandiamide can be...
- DeliveryTime: 7 days after receipt of 30% T/T.
- PackAge: 25kg、500kg、1000kg poly woven bag, or o...
- Port: China Port
- ProductionCapacity: 400 Metric Ton/Month
- Purity: 97.5% min.
- Storage: Store in a dry and well ventilated war...
- Transportation: by sea, by courier, by air, by train.
- LimitNum: 1 Kilogram
- Grade: Industrial Grade,Food Grade,Pharma Gra...
Superiority
Micro-Dicyandiamide
Molecular Formula: C2H4N4 Molecular Weight:84.08
CAS No.:461-58-5
Properties:：
Micro-Dicyandiamide is free flowing White powder.
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.
Specification:
|
Items |
Index |
|
Appearance |
Free Flowing White Powder |
|
Purity (%) |
97.5 min |
|
Free Water (%) |
0.3 max |
|
Melt Point (°C) |
209-212 |
|
Particle Size (98%)［µm］ |
10μm max |
|
Dispersant (%) |
1.5 max |
Usage:
1. Micro-dicyandiamide can be used as One Component Adhesives
2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package.
Details
Micro-Dicyandiamide
Molecular Formula: C2H4N4 Molecular Weight:84.08
CAS No.:461-58-5
Properties:：
Micro-Dicyandiamide is free flowing White powder.
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.
Specification:
|
Items |
Index |
|
Appearance |
Free Flowing White Powder |
|
Purity (%) |
97.5 min |
|
Free Water (%) |
0.3 max |
|
Melt Point (°C) |
209-212 |
|
Particle Size (98%)［µm］ |
10μm max |
|
Dispersant (%) |
1.5 max |
Usage:
1. Micro-dicyandiamide can be used as One Component Adhesives
2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package.